The global Multi-chip Module (MCM) Packaging market was valued at 305 million in 2024 and is projected to reach US$ 410 million by 2032, at a CAGR of 4.4% during the forecast period.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits (ICs or "chips"), semiconductor dies and or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
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We have surveyed the Multi-chip Module (MCM) Packaging manufacturers, suppliers, distributors, and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks
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This report aims to provide a comprehensive presentation of the global market for Multi-chip Module (MCM) Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multi-chip Module (MCM) Packaging. This report contains market size and forecasts of Multi-chip Module (MCM) Packaging in global, including the following market information:
Global Multi-chip Module (MCM) Packaging market revenue, 2020-2025, 2026-2032, ($ millions)
Global Multi-chip Module (MCM) Packaging market sales, 2020-2025, 2026-2032, (K Units)
Global top five Multi-chip Module (MCM) Packaging companies in 2024 (%)
Total Market by Segment:
Global Multi-chip Module (MCM) Packaging market, by Type, 2020-2025, 2026-2032 ($ millions) & (K Units)
Global Multi-chip Module (MCM) Packaging market segment percentages, by Type, 2024 (%)
MCM-D
MCM-C
MCM-L
Global Multi-chip Module (MCM) Packaging market, by Application, 2020-2025, 2026-2032 ($ Millions) & (K Units)
Global Multi-chip Module (MCM) Packaging market segment percentages, by Application, 2024 (%)
PC
SSD
Consumer Electronics
Others
Global Multi-chip Module (MCM) Packaging market, by region and country, 2020-2025, 2026-2032 ($ millions) & (K Units)
Global Multi-chip Module (MCM) Packaging market segment percentages, by region and country, 2024 (%)
North America
US
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Benelux
Rest of Europe
Asia
China
Japan
South Korea
Southeast Asia
India
Rest of Asia
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Turkey
Israel
Saudi Arabia
UAE
Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Multi-chip Module (MCM) Packaging revenues in global market, 2020-2025 (estimated), ($ millions)
Key companies Multi-chip Module (MCM) Packaging revenues share in global market, 2024 (%)
Key companies Multi-chip Module (MCM) Packaging sales in global market, 2020-2025 (estimated), (K Units)
Key companies Multi-chip Module (MCM) Packaging sales share in global market, 2024 (%)
Further, the report presents profiles of competitors in the market, key players include:
Cypress
Samsung
Micron Technology
Winbond
Macronix
ISSI
Eon
Microchip
SK Hynix
Intel
Texas Instruments
ASE
Amkor
IBM
Qorvo
Outline of Major Chapters:
Chapter 1: Introduces the definition of Multi-chip Module (MCM) Packaging, market overview.
Chapter 2: Global Multi-chip Module (MCM) Packaging market size in revenue and volume.
Chapter 3: Detailed analysis of Multi-chip Module (MCM) Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Multi-chip Module (MCM) Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Multi-chip Module (MCM) Packaging capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.
Table of content
1 Introduction to Research & Analysis Reports
1.1 Multi-chip Module (MCM) Packaging Market Definition
1.2 Market Segments
1.2.1 Segment by Type
1.2.2 Segment by Application
1.3 Global Multi-chip Module (MCM) Packaging Market Overview
1.4 Features & Benefits of This Report
1.5 Methodology & Sources of Information
1.5.1 Research Methodology
1.5.2 Research Process
1.5.3 Base Year
1.5.4 Report Assumptions & Caveats
2 Global Multi-chip Module (MCM) Packaging Overall Market Size
2.1 Global Multi-chip Module (MCM) Packaging Market Size: 2024 VS 2032
2.2 Global Multi-chip Module (MCM) Packaging Market Size, Prospects & Forecasts: 2020-2032
2.3 Global Multi-chip Module (MCM) Packaging Sales: 2020-2032
3 Company Landscape
3.1 Top Multi-chip Module (MCM) Packaging Players in Global Market
3.2 Top Global Multi-chip Module (MCM) Packaging Companies Ranked by Revenue
3.3 Global Multi-chip Module (MCM) Packaging Revenue by Companies
3.4 Global Multi-chip Module (MCM) Packaging Sales by Companies
3.5 Global Multi-chip Module (MCM) Packaging Price by Manufacturer (2020-2025)
3.6 Top 3 and Top 5 Multi-chip Module (MCM) Packaging Companies in Global Market, by Revenue in 2024
3.7 Global Manufacturers Multi-chip Module (MCM) Packaging Product Type
3.8 Tier 1, Tier 2, and Tier 3 Multi-chip Module (MCM) Packaging Players in Global Market
3.8.1 List of Global Tier 1 Multi-chip Module (MCM) Packaging Companies
3.8.2 List of Global Tier 2 and Tier 3 Multi-chip Module (MCM) Pac
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